Aufbau/Content: Module (__ ICs, __ Trans., __ Widerst., __ Dioden); Form/Case/Outline: Keramik, 16 (x=8) | 24 (x=12) Pins (DAC336C-x* | DAC336B-x**); Type/Application: x = 8 | 12 -Bit Storage Register DAC; Daten/electr.data: Vcc: 5 V & +/- 15 V; Icc: __ mA; Pd: 300 mW, t op: 0...70 °C* | -55...+125 °C**; Manufactured by Hybrid Systems Corp. -