Aufbau/internal: IC (CMOS); Form/Case/Outline: DIP-8 (XC17256EPC) | SOP-8 (XC17256ESI); Type/Application: 262'144 bits Serial Configuration PROM (SPROM); Daten/electr.data: Vcc: 3.3 | 5 V; Icc: 10 mA (50 µA); t op: C(ommercial)= 0...70 °C, I(ndustrial) = -40...+85 °C. Manufactured by XILINX Corp. (USA) -